T-global Technology Tg997 Silicone Heat Sink Thermal Pad

Silicone Thermal Pad TG997 is a soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the heat from electronic devices, especially in integrated circuit (IC) and LED packaging. TG997 offers low thermal impedance, good surface compliance and a high dielectric breakdown voltage. This thermal pad has very low hardness and elasticity, and yet provides high thermal conductivity, good high temperature resistance and good electrical insulation. TG997 can be supplied in a wide range of formats ranging from custom die cut parts to standard sheets in a range of thicknesses depending on the end application. 
Features 

• Very good thermal conductivity 
• Very soft and high compressibility 
• Natural tack 
• Easy to assemble 
• Very good insulator 
• Tacky on both sides

Applications: Heat dissipation from electronic components. 
Properties 

• REACH Compliant  
• ROHS Compliant 
• Appearance Blue 
• Operating temperature -40 to 200 °C 
• Thermal Conductivity 2.4 W/mK 
• Density 1.8 g/cm³ 
• Hardness 10 Shore A 
• Thickness 0.5mm
• Measurements:  11.5" x 7.75"